■Overview
Space-saving has been demanded for the efficient layout on the substrate to reduce the thickness and miniaturization in cellular phones.
To meet its demands, we have developed <CIM-J38N> considering the reduction of the occupied space on substrate land and the height.
§ Features
1. |
Push-in Push-out eject method, Card ejection stroke: 3.8mm |
2. |
Small size and low profile design
Normal mount type: Height 1.30mm Width 13.7mm Depth 15.3mm |
3. |
Equipped with a pop out prevention mechanism |
4. |
Equipped with a card detection switch (normal open type) |
5. |
Equipped with RFID terminal |
6. |
Enhancement of the grounding for EMI measures |
7. |
Enhancement of the reverse card insertion protection |
§ Main specifications
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|
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Rated voltage |
DC10V |
|
Rated current |
0.5A |
|
Withstanding voltage |
500V AC (r.m.s) for 1 minute |
|
Insulation resistance |
1,000MΩ or more (initial value) |
|
Contact resistance |
100mΩ or less (initial value) |
|
Life (Matching Cycle) |
10,000 times |
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Card insertion force |
4.5~7.5N |
|
Eject force |
4.5~7.5N |
|
Using Temperature Range |
-30 ~ +70ºC |
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Dimensions |
13.7×15.3×1.30(W×D×H (Unit: mm) |
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